职责描述：负责公司功率模块固晶工艺相关工作 •Responsible for Die tacking process jobs •客户样品工艺开发以及相关技术支持 •Customer wafer sample process development and relative technology support •客户培训以及产品工艺介绍 •Customer process training and product process presentation •市场趋势和先进技术研究 •Market survey and new technology study •上级安排的其他相关的任务 •Other duties arranged by direct supervisor •职位地区 - 上海、苏州、深圳、长沙•**** - China East and South office （Shanghai, Suzhou, Shenzhen, Changsha） 任职要求：本科及以上学历(半导体，电力电子、材料类，电子类等相关工科专业背景)，有相关行业经验者优先 •Bachelor degree or above in Semi-conductor, power electronics, Material Science and Electronics, or other engineering field, working experiences of wafer saw process is preferred •英语听说读写(CET-6)，能够适应和国外团队一起合作 •Good English skills - need to work with foreign support team (Singapore, Netherland…) •适应出差(全国) •Can travelling •能够在压力条件下工作 •Can work under pressure •积极主动的学习态度，良好的学习能力 •Work positive, learn fast •优秀的分析和解决问题能力 •Good analysis and trouble-shooting skills